Events

2021 KUNSHAN INNOVATION & ENTREPRENEURSHIP CHALLENGE – ASIA SEMI-FINAL

In collaboration with Overseas Talent Exchange Center and Kunshan local government, Techbridge Ventures will be organizing The Kunshan Innovation and Entrepreneurship Challenge 2021 – Asia Semi-Finals on the 25th February 2021. 

The Challenge is open to Start-ups, SMEs, and Researchers based in Asia, with technology innovations from the following strategic industries of Kunshan:

·         Smart Manufacturing

·         Clean Tech / Renewable Energy

·         Advanced Material

·         Medical Devices

·         Bio Tech

·         Semi-conductor

Participants in the Challenge will have the opportunity to meet and interact with international investors, and pitch their technologies to Kunshan government officials and industries via a closed-door video conference. Cash prizes will be awarded to the top Three Participants in the Asia Semi-Final Round as follows: 

First Prize         :           $1000

Second Prize    :           $800

Third Prize        :           $500 

Participants will stand a chance to win a fully funded trip to Kunshan later this year* to meet local industry collaborators and participate in the Grand Finals, where they will compete against teams from US, Europe, and China. 

Note*: Date is to be determined.

EVENT DETAILS

Date: 25th February 2021, Thursday 4-6pm

Venue: Online

Application Closing Date: 18th February 2021

ABOUT KUNSHAN

Kunshan is a county-level city in southeastern Jiangsu province with Shanghai bordering its eastern border and Suzhou on its western boundary. It is under the administration of the prefecture-level city of Suzhou. As of 2019, Kunshan is considered to have the highest GDP (404.51 billion yuan) of all county-level cities in China.

It has one 100-Billion-yuan industrial cluster for digital technologies and twelve 10-Billion-yuan industrial clusters for other advanced technologies.

For more information, including recent press releases of a "Coffee Innovation Park" by Starbucks and a 5G Millimeter Wave Connector plant by Foxconn  please refer to: https://www.techbridgeventures.com/news-detail/35/ .

APPLICATION INFORMATION

Interested Start-ups, SMEs, and Researchers are welcome to apply via email to innovation@tbv.sg, or register their interest at this link. Interested participants are also welcome to contact Ms Gu +65 85711816 for more information.

Application Closing Date: 15th February 2021.

 

 

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